Encapsulated Electronics

One of the unique capabilities of Affinity is to encapsulate both passive and active electronics.  Our proprietary design and manufacturing processes allow us to encapsulate PCBs into durable and functional interconnect assemblies via overmolding or by employing injection molded, ultrasonically welded shells.

PCB before overmolding
PCB after overmolding
PCB in bottom half of injection molded shell
PCB encapsulated and ultrasonically welded closed
PCB with microprocessor
Overmolded PCB assembly
Finished encapsulated assembly